TDK Xeta Half Brick-iHG User Manual download pdf (Page 10)

Data Sheet: Xeta



iHG48070A033V, 3.3V/70A Output Half Brick Series

iHG Datasheet 2008-05-15 Revision 1.1

℡

(877) 498

0099

10/16

Thermal Performance:

Maximum output current vs. ambient temperature at nominal

input voltage for airflow rates natural convection (0.3m/s) to

3.0m/s with airflow from pin 4 to 1.

Maximum output current vs. ambient temperature at nominal

input voltage for airflow rates natural convection (0.3m/s) to

3.0m/s with airflow from pin 1 to pin 4.

Thermal measurement location – top view

The thermal curves provided are based upon measurements made in TDK Innoveta’s experimental test setup that is

described in the Thermal Management section. Due to the large number of variables in system design, TDK Innoveta

recommends that the user verify the module’s thermal performance in the end application. The critical component

should be thermo-coupled and monitored, and should not exceed the temperature limit specified in the derating curve

above. It is critical that the thermocouple be mounted in a manner that gives direct thermal contact otherwise significant

measurement errors may result.

Thermal

Measurement

Location (Drain

pad of MOSFET)

30 40 50 60 70 80 90 100 110 120 130

Ambient Temperature (C)

O u tp u t C u rre n t (A )

NC 0.3 m/s (60 LFM) 0.5 m/s (100 LFM) 1.0 m/s (200 LFM)

1.5 m/s (300 LFM) 2.0 m/s (400 LFM) 3.0 m/s (600 LFM)

Max MOSFET Temperature

30 40 50 60 70 80 90 100 110 120 130

Ambient Temperature (C)

O u tp u t C u rre n t (A )

NC 0.3 m/s (60 LFM) 0.5 m/s (100 LFM) 1.0 m/s (200 LFM)

1.5 m/s (300 LFM) 2.0 m/s (400 LFM) 3.0 m/s (600 LFM)

Max MOSFET Temperature

1 2 ... 5 6 7 8 9 10 11 12 13 14 15 16

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TDK Xeta Half Brick-iHG User Manual Page 10